AMD: Material agreement · Termination of an agreement · New financial obligation · Leadership change

Item 1.01 Entry into a Material Definitive Agreement. On May 14, 2026 (the “Closing Date”), Advanced Micro Devices, Inc. (the “Company”) entered into a Credit Agreement with the lenders named therein, JPMorgan Chase Bank, N.A., as administrative agent, and the other parties from time to time party thereto (the “Credit Agreement”). The Credit Agreement provides for a five-year, $5.0 billion unsecured revolving credit facility (the “Revolving Facility”) and replaces the Company’s existing Credit Agreement dated as of April 29, 2022, among the Company, the lenders party thereto and Wells Fargo Bank, National Association, as administrative agent (the “Existing Credit Agreement”). The proceeds of any borrowings under the Revolving Facility may be used for general corporate purposes. Up to $250 million of the Revolving Facility may be utilized for the issuance of letters of credit. The issuance of letters of credit reduces the aggregate amount otherwise available under the Revolving Facility for the making of revolving loans. Subject to the terms of the Credit Agreement, the Company may borrow, repay and reborrow revolving loans at any time prior to the earlier of (a) the fifth anniversary of the Closing Date, and (b) the date of termination in whole of the revolving lenders’ commitments under the Credit Agreement in accordance with the terms thereof. As of the Closing Date, there are no borrowings outstanding under the Revolving Facility. Borrowings under the Revolving Facility will bear interest at a fluctuating rate per annum equal to, at the Company’s option, Base Rate (as defined in the Credit Agreement) or Term SOFR (as defined in the Credit Agreement), in each case, plus an applicable margin that is calculated based on the Company’s credit ratings from time to time and