NXPI: Material agreement · New financial obligation

Item 1.01 Entry into a Material Definitive Agreement Facility Agreement On September 1, 2026, NXP B.V., a wholly owned, direct subsidiary of NXP Semiconductors N.V. (the “ Company ”), entered into a facility agreement (the “ Facility Agreement ”) with European Investment Bank (“ EIB ”), which provides for a $250.0 million unsecured senior loan facility. The proceeds from borrowings under the Facility Agreement are expected to be used, to fund the design and implementation of an expansion of an existing semiconductor assembly and test facility (also called back-end manufacturing) located in Kuala Lumpur, Malaysia. NXP B.V.’s obligations under the Facility Agreement, as well as a potential second facility agreement to be entered into in due course, will be fully and unconditionally guaranteed by the Company, as well as NXP Funding LLC (“ NXP Funding ”) and NXP USA, Inc. (“ NXP USA ”), each of which is a wholly owned, indirect subsidiary of the Company, pursuant to a guaranty agreement, entered into on September 2, 2026 (the “ Guaranty ”). Borrowings under the Facility Agreement may be U.S. Dollar or Euro-denominated and bear a fixed or floating interest rate. Fixed rate loans will bear interest at a rate (subject to a floor of zero) to be agreed between NXP B.V. and EIB and shall include a margin determined based on the Company’s credit rating (the “ Margin ”). Floating rate loans will bear interest at a rate (subject to a floor of zero) equal to the sum of the applicable benchmark rate (EURIBOR or USD reference rate, as applicable) and an applicable fixed spread determined by EIB and agreed by NXP B.V. (which includes the Margin). Loans under the Facility Agreement will have a maximum tenor of six years. The Facility Agreement contains affirmative and negative covenants